Přihlašovací formulář
Přihlašovací jméno
Přihlašovací heslo




Zapomenuté heslo|Zaregistrovat se
Osobní údajeObjednávkyPorovnáníOblíbenéReklamaceOdhlášení
cz
CZK
Textové stránky
    cz
    CZK
    Zpět
    1. Hlavní stránka
    2. IT
    3. Servery a zálohování
    4. Servery

    BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR

    Veškeré Supermicro bundly je možné případně upravit na míru. V případě zájmu prosím kontaktujte svého obchodníka nebo produktového manažera..

    Kód produktu205187
    Part numberSYS-111C-NR//B3
     
    Záruka:36 Měsíc(ů)
    Výrobce:Supermicro
    Skladová dostupnost:Na dotaz
    Vaše cena bez DPH
    90873.55 Kč
    Vaše cena včetně DPH
    109957 Kč






    Přidat produkt k porovnání >
    Popis
    Parametry

    Hlavní využití
    Virtualization, HPCCDN, Edge Nodes, Cloud Computing,
    Data Center Optimized, Storage Headnode

    Podrobnosti
    https://www.supermicro.com/en/products/system/up/1u/sys-111c-nr

    Specifikace

    Bundle obsahuje
    SYS-111C-NR UP 1U X13SEDW-F, CSE-LB16TS-R860AW3
    EWCSC 0% 3 YRS LABOR, 3 YRS PARTS, 1 YR CRS
    UNDER LIMITED WRNTY
    P4X-EMR4509Y-SRN61-LCC 4509Y 2P 8C/2.6G/125W (8/1.9, 4/2.7/105)
    22.5M SGX64 DSA 7yr
    SP5
    2xx MEM-DR516MB-ER48 16GB DDR5-4800 1RX8 (16Gb) RDIMM
    2x HDS-M2N4-480G0-E1-TXD-NON-080 SSD M.2 NVMe PCIe4 480GB 1DWPD TLC D,
    80mm
    SKT-1424L-001B-FXC SOCKET E E1B CARRIER LGA 4677 W/SHIM SP
    MCC,LCC,DG1.0 ,RoHS
    CBL-MCIO-1225M5Y MCIO (x8 to 2 x4) STR,25CM,85OHM,RoHS
    CBL-MCIO-1240AM5-X MCIO (x8 to x8) STR,40CM,LNRV,85OHM,RoHS
    MC0037 ASSEMBLY FEE
    Specifikace serveru
    Form Factor 1U Rackmount
    Enclosure: 437 x 43 x 597mm (17.2" x 1.7" x 23.5")
    Package: 605 x 197 x 822mm (23.8" x 7.8" x 32.4")
    Processor Single Socket E (LGA-4677)
    5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
    Up to 64C/128T; Up to 320MB Cache
    GPU Max GPU Count: Up to 2 single-width GPU(s)
    Supported GPU: NVIDIA PCIe: T1000, L4, A2
    CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
    System Memory Slot Count: 16 DIMM slots/8 Channels
    Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
    Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM
    Drive Bays Configuration Default: Total 10 bay(s)
    10 front hot-swap 2.5" PCIe 5.0 NVMe*/SAS*/SATA drive bay(s)
    (*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for
    details)
    M.2: 2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)
    Expansion Slots Default
    2 PCIe 5.0 x16 FHHL slot(s)
    2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
    On-Board Devices SATA: SATA (6Gbps) ; RAID 0/1/5/10 support
    NVMe: NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
    Chipset: Intel® C741
    Network Connectivity: Via AIOM
    IPMI: Support for Intelligent Platform Management Interface v.2.0
    IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s)
    USB: 2 USB 3.2 Gen1 Type-A port(s) (rear)
    2 USB 2.0 Type-A port(s) (front)
    Video: 1 VGA port(s)
    Serial: 1 COM port(s) (Rear)
    TPM: 1 TPM header
    System Cooling Fans: 6 middle cooling PWM 40x40x56mm Fan(s)
    Power Supply 2x 800W/860W Redundant (1 + 1) Titanium Level power supplies
    System BIOS BIOS Type: AMI 32MB SPI Flash EEPROM
    Management CPU: Monitors for CPU Cores, Chipset Voltages, Memory
    8 Phase-switching voltage regulator
    FAN: Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature: Monitoring for CPU and chassis environment
    Thermal Control for fan connector
    PC Health Monitoring FAN: Fans with tachometer monitoring
    Status monitor for speed control
    Pulse Width Modulated (PWM) fan connectors
    Temperature: Monitoring for CPU and chassis environment
    Thermal Control for fan connectors
    Voltage:
    System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU
    thermal trip support
    Dimensions and Weight Weight: Gross Weight: 40 lbs (18.1 kg)
    Net Weight: 25 lbs (11.3 kg)
    Available Color: Black front & silver body
    Operating Environment Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
    Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
    Operating Relative Humidity: 8% to 80% (non-condensing)
    Non-operating Relative Humidity: 8% to 90% (non-condensing)
    Motherboard X13SEDW-F
    Chassis CSE-LB16TS-R0AWNP3
    .
    Provedení serveru: Rack
    HDD Kapacita (GB): 960